TY  - BOOK
T1  - Electrical Design of Through Silicon Via
A2  - Lee, Manho
A2  - Pak, Jun So
A2  - Kim, Joungho
LA  - English
PP  - Dordrecht
PB  - Springer Netherlands : Imprint: Springer
YR  - 2014
UL  - http://vufind10-pruebas.sigbunlp.bibliotecas.unlp.edu.ar/Record/dfi.28339
AB  - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
OP  - 280
CN  - TK7888.4
SN  - 9789401790383
KW  - Special purpose computers.
KW  - Electronic circuits.
KW  - Engineering.
KW  - Circuits and Systems.
KW  - Electronic Circuits and Devices.
ER  -