Cita APA (7a ed.)

Lee, M., Pak, J. S., & Kim, J. (2014). Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer. https://doi.org/10.1007/978-94-017-9038-3

Cita Chicago Style (17a ed.)

Lee, Manho, Jun So Pak, y Joungho Kim. Electrical Design of Through Silicon Via. Dordrecht: Springer Netherlands : Imprint: Springer, 2014. https://doi.org/10.1007/978-94-017-9038-3.

Cita MLA (9a ed.)

Lee, Manho, et al. Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer, 2014. https://doi.org/10.1007/978-94-017-9038-3.